Analytical methods

OFG Analytics uses state-of-the-art instrumental analytical methods from the following fields:

  • Materials Analysis and Testing
  • Failure and Damage Analysis
  • Research and Development (R&D)

Typical methods for this come from the fields of:

  • Surface Analysis (TOF-SIMS, XPS, and SEM)
  • general chemical analysis (FTIR, GC-MS, ICP-OES/MS)
  • microscopic and structural analysis (optical and digital microscopy, cross-sections, AFM)

The selection of the optimal process or combination of processes is based exclusively on the specific needs of our customers. In combination with suitable sample preparation and our many years of experience in data analysis, we can provide you with all the relevant information on the chemical composition, layer structure and microstructure of your products and materials.

Please contact us directly or via our contact form for a personalized consultation.

List of analytical procedures

Time-of-flight secondary ion mass spectrometry

Time-of-flight secondary ion mass spectrometry is a technique characterized by very high detection sensitivity and pronounced surface sensitivity. Typical applications include elemental and molecular imaging of surfaces, depth profile analysis of solids and thin films, as well as trace analysis and the determination of the chemical composition of complex samples.

The operating principle is based on the generation of secondary ions by bombarding a sample surface with high-energy primary ions (e.g., Bi¹⁺). These secondary ions are separated in the mass spectrometer according to their mass-to-charge ratio and analyzed using time-of-flight (ToF) measurement. This allows even the smallest amounts of material to be clearly identified.

The TOF-SIMS technique is characterized by extremely high surface sensitivity and very high detection sensitivity. A particularly important variant is static SIMS (SSIMS). In this method, a very low primary ion dose is used, making the analysis virtually non-destructive.

Fourier transform infrared spectroscopy

Measurement of IR absorption for the identification of functional groups. Fast and minimally invasive; ideal for material and polymer characterization (organic).

X-ray photoelectron spectroscopy
X-rays eject electrons from the surface; the energy of these electrons provides information about the elemental composition and chemical bonding state; a surface-sensitive and quantitative method.

Scanning electron microscopy with
energy-dispersive X-ray analysis

Scanning electron microscopy is a widely used technique for high-resolution imaging of the topography of solid surfaces with a large depth of field. It is routinely used to inspect product surfaces and microstructures, particularly in the context of failure analysis and quality assurance. Other typical applications include fracture analysis of metallic materials and film thickness measurements in thin-film technology.

The operating principle is based on scanning the sample surface with a sharply focused electron beam. The interaction of the primary electrons with the sample material results in the emission of secondary electrons as well as material-dependent backscattered electrons (BSE).

For raster scanning, the diameter of the primary electron beam is greatly reduced so that, depending on the electron source, the probe diameter is in the range of a few nanometers when it strikes the sample surface. The intensity of the emitted secondary and backscattered electrons is detected and represented as a position-dependent image signal.

Secondary electrons primarily provide information about the surface topography, while backscattered electrons also reveal material contrasts. This results in a highly detailed image of the sample surface with high lateral resolution.

X-ray microanalysis (EDX)

X-ray microanalysis is a technique used to determine the elemental composition of near-surface regions of solids and to characterize thin films. It is primarily used for rapid screening analysis and is typically combined with an electron microscope.

When a sample is irradiated with high-energy electrons, the material emits characteristic X-rays. In this process, electrons are knocked out of the inner atomic shells. As electrons from higher shells fill the resulting vacancies, the energy difference is released in the form of element-specific X-rays.

Analysis of the X-ray emission spectrum allows for the identification of the elements present and—based on the intensity of the spectral lines—quantitative analysis (for elements with atomic numbers between >). The typical depth of information is approximately 1 µm.

Analysis is performed using either energy-dispersive (EDX: Energy Dispersive X-ray Spectroscopy) or wavelength-dispersive (WDX: Wavelength Dispersive X-ray Spectroscopy) methods. By scanning the electron beam, the lateral distribution of elements on the sample surface can also be visualized.

Glow lamp emission spectral analysis

Gas Chromatography–Mass Spectrometry

Thermogravimetric Analysis

Dynamic Differential Scanning Calorimetry

Metal microscope, stereo microscope, digital microscope

In addition, we also offer other methods upon request, such as:

  • ICP-MS/OES – Inductively Coupled Plasma Mass Spectrometry (Optical Emission Spectrometry)
  • SNMS – Secondary Neutral Mass Spectrometry
  • AFM – Atomic Force Microscopy
  • XRD – X-ray diffraction
  • and more

Depending on the sample material and the analytical objective, the methods described are supplemented by specialized modifications as well as by methods from materials testing, chemical analysis, or physical measurement technology.

ToF-SIMS
FT-IR microscope
FT-IR microscope

Analytical information

What information do the procedures provide?

Modern surface and thin-layer analytical methods can image submicroscopically small sample areas and the smallest amounts of substances and analyze them with the highest sensitivity.

Depending on the issue at hand, we carry out investigations into:

Determination of the chemical composition

  • of any materials or component surfaces
  • of interfaces between poorly adhering layer areas
  • of organic trace contaminants
  • of functionally coated or pre-treated surfaces
  • of substances in the bulk material (material determination)
  • of deposits, coatings, efflorescence on component surfaces
  • of cracked surfaces

Material characterization and identification

  • Fats, oils, surfactants, release agents
  • Plastic/oil additives
  • Lacquer, paint, adhesive components
  • Plastics, polymers, biomolecules, pharmaceuticals
  • Aerosol particles (adsorbed on metal sheets)
  • Particles, fibers, inclusions
Lackschiff

Determination of the layer structure of multilayer systems

  • Representation of the layer sequence in cross-section
  • Determination of the individual layer thicknesses
  • Determination of element composition as a function of layer depth (depth profile analysis)
  • Characterization of inclusions in the layer structure
  • Accumulation of foreign elements in the interfaces between individual layers
Zink

Representation of the topography and microstructure

  • Topography of any material/product surface
  • Determination of micro-roughness and roughness parameters
  • Imaging of microparticles, fibers
  • Representation of micro-/ nanostructured surfaces
  • Visualization of submicroscopically small defect areas